Seung-Yong Cha

This inventor holds 27 USPTO granted patents and 2 published patent applications and 7 EPO patents, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2009-2023.

USPTO Granted Patents = 27 (Patent Applications = 2)

% Patents Active = 66.7

EPO Patents = 7 (Patent Applications = 10)

Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 412(Granted Patents)

Location History:

Gwangju, KR (2009 - 2014)
Hwaseong-si, KR (2013 - 2023)

Company Filing History:

27 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2009-2023

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Areas of Expertise:

System-in-Package

Electronic Device Package

Image Sensor Package

Semiconductor Memory Device

Signal Integrity

Thermal Blocks

Vacuum Cleaner

Cyclone Dust-Separating

Dust Compressing Apparatus

Suction Body

Suction Nozzle

Connecting Tube

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11837577 - System-in-package module (2023-12-05),

2. 11398454 - System-in-package module (2022-07-26),

3. 11244938 - Electronic device package (2022-02-08),

4. 10879294 - Image sensor package having multi-level stack structure (2020-12-29),

5. 10541263 - Image sensor package having multi-level stack structure (2020-01-21),

6. 10424571 - Electronic device package (2019-09-24),

7. 10037938 - Semiconductor packages (2018-07-31),

8. 9830973 - Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure (2017-11-28),

9. 9799591 - Semiconductor packages including thermal blocks (2017-10-24),

10. 9721644 - Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure (2017-08-01),

11. 9659852 - Semiconductor package (2017-05-23),

12. 9041222 - Semiconductor device (2015-05-26),

13. 8866310 - Semiconductor device (2014-10-21),

14. 8826489 - Suction body providing electric energy and cleaner having the same (2014-09-09),

15. 8421497 - Semiconductor chip and semiconductor module including the semiconductor chip (2013-04-16),

Title: Seung-Yong Cha: Pioneering Innovator in Technology

Introduction:

Seung-Yong Cha, based in Gwangju, South Korea, has carved a path as a trailblazer in the world of invention through his passion for innovation and relentless pursuit of excellence. His remarkable contributions have not only shaped the landscape of technology but also serve as a beacon for aspiring inventors worldwide.

Latest Patents:

With an impressive portfolio of 27 patents, Seung-Yong Cha's most recent innovations include the development of a cutting-edge System-in-Package module. This revolutionary module features an application-specific integrated circuit (ASIC) chip, coupled with advanced wafer-level package (WLP) memories, showcasing his prowess in advancing technology's frontiers.

Career Highlights:

Seung-Yong Cha currently applies his inventive genius at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology. His tenure at Samsung has been marked by a series of groundbreaking inventions that have garnered acclaim within the industry and beyond.

Collaborations:

Collaborating closely with esteemed coworkers such as Jang-Keun Oh and Keung Beum Kim, Seung-Yong Cha operates within a dynamic and innovative environment that fosters creativity and collaboration. Together, they form a formidable team that is instrumental in driving forward technological advancements.

Conclusion:

Seung-Yong Cha's unwavering dedication to innovation and his exceptional track record of inventions underscore his status as a pioneering figure in the realm of technology. His work not only shapes the present but also paves the way for future generations of inventors to follow in his illustrious footsteps, ensuring a legacy of innovation that endures through time.