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For the Inventor, By the Inventor

Singapore, Singapore

Setho Sing Fee

USPTO Granted Patents = 30


Average Co-Inventor Count = 2.6

ph-index = 11

Forward Citations = 1,220(Granted Patents)


Company Filing History:

goldMedal26 out of 38,002 
 
Micron Technology Incorporated
 patents
silverMedal4 out of 103 
 
St Assembly Test Services Inc.
 patents

Years Active: 2002-2014

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30 patents (USPTO):Explore Patents
1. 8709866 - Methods of forming integrated circuit packages (2014-04-29),
2. 8703599 - Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts (2014-04-22),
3. 8531031 - Integrated circuit packages (2013-09-10),
4. 8319332 - Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts (2012-11-27),
5. 7977157 - Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages (2011-07-12),
6. 7745944 - Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts (2010-06-29),
7. 7700406 - Methods of assembling integrated circuit packages (2010-04-20),
8. 7573136 - Semiconductor device assemblies and packages including multiple semiconductor device components (2009-08-11),
9. 7528007 - Methods for assembling semiconductor devices and interposers (2009-05-05),
10. 7294911 - Ultrathin leadframe BGA circuit package (2007-11-13),
11. 7279780 - Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same (2007-10-09),
12. 7274095 - Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers (2007-09-25),
13. 7198980 - Methods for assembling multiple semiconductor devices (2007-04-03),
14. 7183134 - Ultrathin leadframe BGA circuit package (2007-02-27),
15. 7112876 - Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers (2006-09-26),

Title: The Innovative Journey of Setho Sing Fee

Introduction: Setho Sing Fee is a pioneering inventor hailing from Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Setho Sing Fee holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a career spanning over two decades, Setho Sing Fee has worked tirelessly to bring her innovative ideas to life. Her work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations: Throughout her career, Setho Sing Fee has collaborated with leading research institutions, universities, and tech companies to further develop and implement her inventions. Her collaborative spirit has led to the successful realization of numerous groundbreaking projects.

Conclusion: Setho Sing Fee's dedication to innovation and her relentless pursuit of excellence have solidified her position as a trailblazer in the world of inventions. Her work continues to impact industries and pave the way for a more sustainable future.

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