The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2009
Filed:
May. 27, 2005
Tongbi Jiang, Boise, ID (US);
Setho Sing Fee, Singapore, SG;
Tay Wuu Yean, Singapore, SG;
Lim Thiam Chye, Singapore, SG;
Tongbi Jiang, Boise, ID (US);
Setho Sing Fee, Singapore, SG;
Tay Wuu Yean, Singapore, SG;
Lim Thiam Chye, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g., semiconductor devices) may be assembled with the interposer. For example, at least one contact pad of a semiconductor device component adjacent to one surface of the interposer may be electrically connected to a corresponding contact pad of another semiconductor device component positioned adjacent to an opposite surface of the interposer. As another example, multiple semiconductor device components may be at least partially superimposed relative to one another and at least partially disposed within a receptacle of the interposer.