Portland, OR, United States of America

Seshu V Sattiraju

This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2006-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seshu V Sattiraju. Retrieved from https://idiyas.com/inventor/seshu-v-sattiraju

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 7.4

ph-index = 3

Forward Citations = 45(Granted Patents)


Company Filing History:


Years Active: 2006-2016

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4 patents (USPTO):Explore Patents

Title: Innovations of Seshu V Sattiraju

Introduction

Seshu V Sattiraju is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of 3D interconnect structures. With a total of 4 patents to his name, Sattiraju's work has advanced the capabilities of integrated circuits.

Latest Patents

Sattiraju's latest patents include innovative designs for 3D interconnect structures. One of his patents describes a 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach. This invention outlines a method of manufacture where through-silicon vias (TSVs) and metal redistribution layers (RDLs) are formed using a dual damascene type process flow. A silicon nitride or silicon carbide passivation layer may be provided between the thinned device wafer back side and the RDLs to create a hermetic barrier and etch stop layer during the process flow.

Another patent focuses on a 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias. This invention also describes a method of manufacture where metal redistribution layers (RDLs) are integrated with through-silicon vias (TSVs) using a single damascene type process flow. Similar to his other patent, a silicon nitride or silicon carbide passivation layer may be provided between the thinned device wafer back side and the RDLs to ensure a hermetic barrier and polish stop layer during the process flow.

Career Highlights

Sattiraju is currently employed at Intel Corporation, where he continues to innovate and develop advanced semiconductor technologies. His work has been instrumental in enhancing the performance and reliability of integrated circuits.

Collaborations

Some of his notable coworkers include Kevin J Lee and Mark T Bohr, who have also made significant contributions to the field of semiconductor technology.

Conclusion

Seshu V Sattiraju's contributions to the field of semiconductor technology through his innovative patents have made a lasting impact. His work at Intel Corporation exemplifies the importance of research and development in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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