Average Co-Inventor Count = 7.41
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Intel Corporation (4 from 54,858 patents)
4 patents:
1. 9530740 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
2. 9449913 - 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
3. 9142510 - 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
4. 7064446 - Under bump metallization layer to enable use of high tin content solder bumps