The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Mar. 29, 2004
John P. Barnak, Beaverton, OR (US);
Gerald B. Feldewerth, Beaverton, OR (US);
Ming Fang, Portland, OR (US);
Kevin J. Lee, Beaverton, OR (US);
Tzuen-luh Huang, Portland, OR (US);
Harry Y. Liang, Portland, OR (US);
Seshu V. Sattiraju, Portland, OR (US);
Margherita Chang, Portland, OR (US);
Andrew W. H. Yeoh, Portland, OR (US);
John P. Barnak, Beaverton, OR (US);
Gerald B. Feldewerth, Beaverton, OR (US);
Ming Fang, Portland, OR (US);
Kevin J. Lee, Beaverton, OR (US);
Tzuen-Luh Huang, Portland, OR (US);
Harry Y. Liang, Portland, OR (US);
Seshu V. Sattiraju, Portland, OR (US);
Margherita Chang, Portland, OR (US);
Andrew W. H. Yeoh, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Apparatus and methods of fabricating an under bump metallization structure including an adhesion layer abutting a conductive pad, a molybdenum-containing barrier layer abutting the adhesion layer, a wetting layer abutting the molybdenum-containing barrier layer, and high tin content solder material abutting the wetting layer. The wetting layer may be substantially subsumed in the high content solder forming an intermetallic compound layer. The molybdenum-containing barrier layer prevents the movement of tin in the high tin content solder material from migrating to dielectric layers abutting the conductive pad and potentially causing delamination and/or attacking any underlying structures, particularly copper structures, which may be present.