Company Filing History:
Years Active: 2006
Title: The Innovations of Harry Y Liang
Introduction
Harry Y Liang is a notable inventor based in Portland, Oregon. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on improving the reliability and performance of electronic components.
Latest Patents
Harry Y Liang holds a patent for an innovative method titled "Under bump metallization layer to enable use of high tin content solder bumps." This patent describes an apparatus and methods for fabricating an under bump metallization structure. The structure includes an adhesion layer abutting a conductive pad, a molybdenum-containing barrier layer, a wetting layer, and high tin content solder material. The molybdenum-containing barrier layer plays a crucial role in preventing the movement of tin in the solder material, which can lead to delamination and damage to underlying structures.
Career Highlights
Harry Y Liang is currently employed at Intel Corporation, a leading company in the semiconductor industry. His work at Intel has allowed him to contribute to cutting-edge technologies that enhance electronic devices. With a focus on innovation, he has been instrumental in developing solutions that address critical challenges in the field.
Collaborations
Throughout his career, Harry has collaborated with esteemed colleagues such as John P Barnak and Gerald B Feldewerth. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Harry Y Liang's contributions to the field of semiconductor technology exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to enhancing electronic components. His achievements serve as an inspiration for future inventors in the industry.