Sek Hoi Chong

Title: Innovations by Sek Hoi Chong in Integrated Circuit Packaging

Introduction

Sek Hoi Chong is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. His work focuses on innovative methods and systems that enhance the efficiency and effectiveness of packaging integrated circuits.

Latest Patents

One of his latest patents is titled "Methods and systems of packaging integrated circuits." This invention describes panel-level methods and systems for packaging integrated circuits. In this method, a substrate formed from a sacrificial semiconductor wafer is provided, featuring a plurality of metallized device areas patterned thereon. Each device area includes an array of metallized contacts and a die attach area. Dice are mounted onto each device area and electrically connected to the array of contacts. The entire surface of the substrate, including the dice, contacts, and electrical connections, is then encapsulated. The semiconductor wafer is sacrificed, leaving portions of the contacts exposed, allowing them to be used as external contacts in an IC package. Various embodiments may incorporate other structures, including die attach pads, as desired. Structures with thicknesses in the range of 10 to 20 microns are readily attainable.

Another significant patent is "Panel level methods and systems for packaging integrated circuits with integrated heat sinks." This invention describes methods and arrangements for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages, each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.

Career Highlights

Sek Hoi Chong is currently employed at National Semiconductor Corporation, where he continues to innovate in the field of semiconductor technology. His work has contributed to advancements in the efficiency and performance of integrated circuits.

Collaborations

He has collaborated with notable coworkers, including Shee Min Yeong and Peng Soon Lim, who have also contributed to the field of integrated circuit packaging.

Conclusion

Sek Hoi Chong's innovative work in integrated circuit packaging has led to significant advancements in the industry. His patents reflect a commitment to improving technology and enhancing the functionality of integrated circuits.