The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Feb. 01, 2008
Applicants:
Sek Hoi Chong, Melaka, MY;
Shee Min Yeong, Melaka, MY;
Danny Cher Hau Koh, Melaka, MY;
Eugene Kai Poh Wong, Pahang, MY;
Inventors:
Sek Hoi Chong, Melaka, MY;
Shee Min Yeong, Melaka, MY;
Danny Cher Hau Koh, Melaka, MY;
Eugene Kai Poh Wong, Pahang, MY;
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package.