Danny Cher Hau Koh

Title: The Innovations of Danny Cher Hau Koh

Introduction

Danny Cher Hau Koh is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of methods that enhance the efficiency and effectiveness of heat sink integration in electronic devices.

Latest Patents

Danny holds a patent for "Panel level methods and systems for packaging integrated circuits with integrated heat sinks." This patent describes various methods for attaching heat sinks in panel form with dice attached to a leadframe panel. The technology results in integrated circuit packages that feature an exposed heat sink on one outer surface and an exposed die attach pad on the opposite surface. This innovation is crucial for improving thermal management in electronic devices.

Career Highlights

Danny is currently employed at National Semiconductor Corporation, where he continues to work on advancing semiconductor technologies. His expertise in integrated circuit packaging has positioned him as a valuable asset to the company. With a focus on innovation, he has contributed to the development of cutting-edge solutions in the semiconductor industry.

Collaborations

Danny has collaborated with talented individuals such as Shee Min Yeong and Eugene Kai Poh Wong. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions.

Conclusion

Danny Cher Hau Koh's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patent and work at National Semiconductor Corporation highlight his role as a leading inventor in the semiconductor industry.