Company Filing History:

6 out of 70

World Properties, Inc.

1 out of 832,843

Other

patents

Years Active: 2006-2018

Loading Chart...

12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10104769 - Circuit materials with improved fire retardant system and articles formed therefrom (2018-10-16),

2. 9918384 - Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof (2018-03-13),

3. 9265160 - Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith (2016-02-16),

4. 8809690 - Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof (2014-08-19),

5. 8722192 - Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom (2014-05-13),

6. 8632874 - Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith (2014-01-21),

7. 8519273 - Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom (2013-08-27),

8. 8431222 - Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom (2013-04-30),

9. 8349460 - Organosilicon copolymer composites, method of manufacture, and articles formed therefrom (2013-01-08),

10. 8257820 - Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom (2012-09-04),

11. 8187696 - Circuit materials, circuits laminates, and method of manufacture thereof (2012-05-29),

12. 6994896 - Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom (2006-02-07),

Title: Inventor Spotlight: Sankar Paul

Introduction

Sankar Paul, an innovative inventor based in Branford, Connecticut, has made significant contributions to the field of circuit materials. With a total of 12 patents to his name, Paul’s work focuses on improving the safety and efficiency of electronic components.

Latest Patents

Sankar Paul’s latest patents include groundbreaking advancements in circuit materials with improved fire retardant systems. One notable invention is a circuit subassembly featuring a conductive layer and a dielectric layer made from a specialized thermosetting composition. This composition includes a low polarity resin and an oxaphosphorinoxide-containing aromatic compound, ensuring that the circuit subassembly meets a UL-94 V-0 rating, which signifies excellent fire resistance.

Additionally, he has developed dielectric bond plies for circuits and multilayer circuits. This innovation comprises a unique three-layer bond ply design that utilizes thermosetting compositions and fillers, enhancing the overall performance and durability of electronic circuits.

Career Highlights

Throughout his career, Sankar Paul has worked with leading companies in the industry, including World Properties, Inc. and Rogers Corporation. His expertise in materials science and engineering has positioned him as a key figure in developing cutting-edge technologies that prioritize safety and efficiency in electronic products.

Collaborations

In his professional journey, Paul has collaborated with esteemed colleagues such as Dirk M. Baars and Allen F. Horn III. These partnerships have fostered creativity and innovation, driving advancements in circuit technology.

Conclusion

Sankar Paul’s contributions to the field of circuit materials are invaluable, with his patents paving the way for safer and more efficient electronic components. His dedication to innovation and collaboration highlights his commitment to advancing technology in the industry.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com