The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Dec. 06, 2013
Applicant:
Rogers Corporation, Rogers, CT (US);
Inventors:
Sankar Paul, Branford, CT (US);
Scott D. Kennedy, Canterbury, CT (US);
Dirk M. Baars, South Windsor, CT (US);
Assignee:
ROGERS CORPORATION, Rogers, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); C08G 65/48 (2006.01); C08L 71/12 (2006.01); C09J 107/00 (2006.01); C09J 113/00 (2006.01); C09J 171/12 (2006.01); H05K 3/00 (2006.01); C08K 3/00 (2006.01); C08L 9/00 (2006.01); C08L 13/00 (2006.01); C08L 15/00 (2006.01); C08L 19/00 (2006.01); C08L 51/04 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4626 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); C08G 65/485 (2013.01); C08L 71/12 (2013.01); C08L 71/126 (2013.01); C09J 107/00 (2013.01); C09J 113/00 (2013.01); C09J 171/12 (2013.01); H05K 3/00 (2013.01); H05K 3/4676 (2013.01); C08K 3/0033 (2013.01); C08L 9/00 (2013.01); C08L 13/00 (2013.01); C08L 15/00 (2013.01); C08L 19/006 (2013.01); C08L 51/04 (2013.01); H05K 1/0393 (2013.01); H05K 3/462 (2013.01); H05K 3/4641 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10378 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24802 (2015.01); Y10T 428/263 (2015.01); Y10T 428/31544 (2015.04); Y10T 428/31931 (2015.04);
Abstract
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.