The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
May. 28, 2015
Applicant:
Rogers Corporation, Rogers, CT (US);
Inventors:
William F. Scholz, Scottsdale, AZ (US);
Sankar Paul, Branford, CT (US);
Assignee:
ROGERS CORPORATION, Rogers, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08K 5/53 (2006.01); C08K 5/5313 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08K 5/5313 (2013.01); H05K 3/4655 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0195 (2013.01); Y10T 156/10 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/24917 (2015.01);
Abstract
A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply.