Company Filing History:
Years Active: 1999-2019
Title: William F Scholz: Innovator in Circuit Assembly Technologies
Introduction
William F Scholz is an accomplished inventor based in Scottsdale, AZ, known for his significant contributions to the field of circuit assembly technologies. With a total of four patents to his name, Scholz has demonstrated a commitment to advancing technology in this sector through his innovative designs and compositions.
Latest Patents
Scholz's latest patents focus on enhancing the performance and safety of circuit assemblies. One notable patent is related to bond ply materials, which details a composition for a bond ply and a circuit subassembly that includes this bond ply, capable of achieving a UL-94 rating of V-0. The composition consists of 25 to 45 volume percent liquid resin, 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound with a melting point of at least about 260°C, and 5 to 35 volume percent inorganic filler.
Another recent patent from Scholz encompasses improvements in circuit materials, which detail a circuit subassembly containing a conductive layer and a dielectric layer formed from a thermosetting composition. This composition incorporates a low polarity resin, an oxaphosphorinoxide-containing aromatic compound, and a protective adhesive layer, ensuring that the final assembly maintains a UL-94 rating of at least V-0.
Career Highlights
Throughout his career, Scholz has made significant contributions while working for prominent companies such as BetzDearborn, Inc. and Rogers Corporation. His work at these organizations has allowed him to refine his skills and expand his knowledge in the field of electrical engineering and materials science.
Collaborations
William F Scholz has collaborated with esteemed colleagues such as Tien-Feng Ling and Sankar Paul, leveraging their expertise to enhance the quality and effectiveness of their inventions. These partnerships highlight the importance of teamwork in driving innovation and achieving remarkable outcomes in circuit assembly technologies.
Conclusion
William F Scholz continues to be a pivotal figure in the realm of circuit assembly innovations. His impressive portfolio of patents showcases his dedication to improving the safety and effectiveness of electronic materials. As technology advances, contributions from inventors like Scholz will undoubtedly continue to shape the future of circuit design and application.