The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Nov. 25, 2015
Applicant:
Rogers Corporation, Rogers, CT (US);
Inventor:
William F. Scholz, Scottsdale, AZ (US);
Assignee:
ROGERS CORPORATION, Rogers, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 147/00 (2006.01); C09J 153/02 (2006.01); H05K 1/03 (2006.01); C09J 7/00 (2018.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01); C09J 7/10 (2018.01); C09K 21/12 (2006.01);
U.S. Cl.
CPC ...
C09J 147/00 (2013.01); C09J 7/00 (2013.01); C09J 7/10 (2018.01); C09J 153/02 (2013.01); H05K 1/03 (2013.01); H05K 1/144 (2013.01); H05K 3/4635 (2013.01); C08J 2421/00 (2013.01); C08J 2447/00 (2013.01); C08J 2471/00 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2409/00 (2013.01); C09J 2421/00 (2013.01); C09J 2423/00 (2013.01); C09J 2471/00 (2013.01); H05K 3/4623 (2013.01);
Abstract
A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260° C.; and 5 to 35 volume percent inorganic filler.