The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Mar. 04, 2011
Applicants:

Dirk M. Baars, South Windsor, CT (US);

Dale J. Doyle, Santee, CA (US);

Sankar J. Paul, Branford, CT (US);

Diana J. Williams, Queen Creek, AZ (US);

Carlos L. Barton, Brooklyn, CT (US);

Inventors:

Dirk M. Baars, South Windsor, CT (US);

Dale J. Doyle, Santee, CA (US);

Sankar J. Paul, Branford, CT (US);

Diana J. Williams, Queen Creek, AZ (US);

Carlos L. Barton, Brooklyn, CT (US);

Assignee:

Rogers Corporation, Rogers, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.


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