Company Filing History:
7 out of 295 
2 out of 70 
1 out of 832,843 Years Active: 1985-2018
Title: **Carlos L. Barton: A Pioneer in Dielectric Bond Technology**
Introduction
Carlos L. Barton, an innovative inventor based in Brooklyn, Connecticut, has made significant contributions to the field of circuit technology. With a portfolio of ten patents to his name, Barton has established himself as a prominent figure in his industry, particularly for his advancements in dielectric bond ply technology.
Latest Patents
One of Barton's latest patents is focused on dielectric bond plies for circuits and multilayer circuits. This invention presents a sophisticated bond ply that includes a first and second outer layer, each made from a thermosetting composition and filler. An intermediate layer, positioned between the two outer layers, features a thermosetting composition with a higher degree of cure compared to the outer layers. This distinct design enhances the durability and reliability of multilayer circuit technologies.
Career Highlights
Carlos L. Barton has garnered extensive experience working with notable companies such as Rogers Corporation and World Properties, Inc. His professional journey reflects a commitment to developing innovative solutions that address contemporary challenges in the electronics sector. Throughout his career, Barton has focused on enhancing circuit design through innovative bonding materials and methods.
Collaborations
In his quest for innovation, Barton has collaborated with talented individuals such as Richard T. Traskos and Dirk M. Baars. These partnerships have fostered collective advancements in technology and have contributed to the success of Barton's inventions.
Conclusion
Carlos L. Barton stands out as a dedicated inventor whose work continues to impact the field of circuit technology. With his impressive portfolio of patents and his collaboration with esteemed professionals, Barton exemplifies the spirit of innovation in the engineering landscape. His contributions pave the way for future developments in multilayer circuits and dielectric bonding solutions.