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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9918384 B1

PDFFull Text
Date of Patent:
Mar. 13, 2018

Filed:

Jul. 11, 2014

Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof

Applicant:

Rogers Corporation, Rogers, CT (US);

Inventors:

Dirk M. Baars, South Windsor, CT (US);

Dale J. Doyle, Santee, CA (US);

Sankar J. Paul, Branford, CT (US);

Diana J. Williams, Queen Creek, AZ (US);

Carlos L. Barton, Brooklyn, CT (US);

Assignee:

ROGERS CORPORATION, Rogers, CT (US);

Attorney:

Cantor Colburn LLP

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/02 (2006.01); B29C 65/48 (2006.01); B29C 65/54 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 38/18 (2006.01); B32B 43/00 (2006.01); H05K 1/11 (2006.01); B05D 5/12 (2006.01); B32B 27/04 (2006.01); B32B 27/38 (2006.01); B32B 37/00 (2006.01); B44C 1/17 (2006.01); H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); B05D 5/12 (2013.01); B32B 27/04 (2013.01); B32B 27/38 (2013.01); B32B 37/00 (2013.01); B44C 1/17 (2013.01); H05K 1/00 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 3/386 (2013.01); Y10T 156/1089 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/2826 (2015.01);
Abstract

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

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