Phoenix, AZ, United States of America

Sandeep Gaan

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 7.3

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2021-2022

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4 patents (USPTO):

Title: Sandeep Gaan: Innovator in Electronics Packaging

Introduction

Sandeep Gaan is a prominent inventor based in Phoenix, AZ (US). He has made significant contributions to the field of electronics packaging, holding a total of 4 patents. His work focuses on innovative methods and designs that enhance the performance and efficiency of electronic components.

Latest Patents

One of Sandeep's latest patents is titled "Thin film barrier seed metallization in magnetic-plugged through hole inductor." This invention includes inductors and methods of forming inductors. In this embodiment, an inductor may consist of a substrate core and a conductive through-hole through the substrate core. Additionally, it may feature a magnetic sheath surrounding the conductive through hole, with a barrier layer separating the magnetic sheath from the plated through hole. This barrier layer is formed over the inner surface of the magnetic sheath and over the first and second surfaces of the sheath.

Another notable patent is the "Interposer package-on-package (PoP) with solder array thermal contacts." This invention encompasses an electronics package and methods of forming such packages. In this embodiment, the electronics package comprises a first package substrate, which includes a die embedded in a mold layer, a thermal interface pad over the surface of the die, and a plurality of solder balls over the thermal interface pad. The thermal interface pad and the solder balls are electrically isolated from the circuitry of the electronics package. Furthermore, the electronics package may also include a second package substrate positioned over the first package substrate.

Career Highlights

Sandeep Gaan is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies in electronics. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.

Collaborations

Throughout his career, Sandeep has collaborated with talented individuals such as Kristof Darmawikarta and Srinivas V Pietambaram. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Sandeep Gaan is a notable inventor whose contributions to electronics packaging have led to several innovative patents. His work at Intel Corporation and collaborations with other professionals highlight his commitment to advancing technology in the electronics field.

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