San Leong Liew

Title: Innovations of San Leong Liew in Semiconductor Manufacturing

Introduction

San Leong Liew is a notable inventor based in Singapore, recognized for his contributions to semiconductor manufacturing. He holds two patents that showcase his expertise in the field. His work primarily focuses on enhancing interconnect technologies, which are crucial for the performance of integrated circuits.

Latest Patents

Liew's latest patents include a method for the entire encapsulation of copper interconnects using a self-aligned CuSiN film. This innovative method involves forming a barrier layer and cap comprised of CuSiN for an interconnect. The process includes providing an interconnect opening in a dielectric layer over a semiconductor structure, followed by the formation of a CuSiN barrier layer over the sidewalls and bottom of the interconnect opening. Additionally, he has developed a method to form alpha phase tantalum (Ta) and its application in IC manufacturing. This method includes sputtering a Ta layer on a copper layer at controlled substrate temperatures, ensuring optimal conditions for semiconductor performance.

Career Highlights

San Leong Liew is currently employed at Chartered Semiconductor Manufacturing Ltd, where he continues to innovate in the semiconductor industry. His work has significantly impacted the development of advanced interconnect technologies, which are essential for modern electronic devices.

Collaborations

Liew has collaborated with notable colleagues, including Bei Chao Zhang and John Leonard Sudijono. These collaborations have further enhanced the research and development efforts within the semiconductor manufacturing sector.

Conclusion

San Leong Liew's contributions to semiconductor manufacturing through his innovative patents demonstrate his significant role in advancing technology in this field. His work continues to influence the development of efficient interconnect solutions for integrated circuits.