Location History:
- Kuala Terengganu, MY (2002)
- Terrengganu, MY (2003)
Company Filing History:
Years Active: 2002-2003
Title: Innovations by Saat Shukri Embong
Introduction
Saat Shukri Embong is a notable inventor based in Kuala Terengganu, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for manufacturing electronic devices, showcasing his expertise and creativity in the industry.
Latest Patents
Among his latest patents is a method for manufacturing an electronic device package. This system includes a conveyor with an adhesive work surface designed to support a predetermined array of external connectors for flip-chip bonding of dies. After assembly, the dies, along with their associated external connectors, are encapsulated on the conveyor's work surface, which forms part of the inner surface of an encapsulating mold. Another significant patent is for a ball-less clip bonding method. This invention involves a semiconductor component that includes a semiconductor chip, an electrically conductive adhesive, and a clip bond that retains the adhesive with at least one burr.
Career Highlights
Saat Shukri Embong is currently employed at Semiconductor Components Industries, LLC, where he continues to innovate and develop new technologies. His work has had a substantial impact on the semiconductor industry, enhancing the efficiency and effectiveness of electronic device manufacturing.
Collaborations
He collaborates with talented coworkers, including Chee Hiong Chew and Boon Huat Lim, who contribute to the innovative environment at Semiconductor Components Industries, LLC.
Conclusion
In summary, Saat Shukri Embong is a distinguished inventor whose work in semiconductor technology has led to multiple patents and advancements in electronic device manufacturing. His contributions continue to shape the industry and inspire future innovations.