The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2002
Filed:
Nov. 06, 2000
James Price Letterman, Jr., Mesa, AZ (US);
Kenneth Teik Kheong Low, Singapore, SG;
Saat Shukri Embong, Kuala Terengganu, MY;
Chee Hiong Chew, Negeri Sembilan, MY;
Boon Huat Lim, Johor, MY;
Aik Chong Tan, Johor Bahru, MY;
Albert Laninga, Tempe, AZ (US);
Santhiragasen al sengram Pillay, Negeri Sembilan, MY;
Michael John Seddon, Gilbert, AZ (US);
Brian Webb, Chandler, AZ (US);
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Abstract
A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.