Location History:
- Johor, MY (2002 - 2014)
- Muar, MY (2016)
Company Filing History:
3 out of 14,724 
2 out of 3,593 
Years Active: 2002-2016
Title: Boon Huat Lim: Innovator in Semiconductor Packaging
Introduction
Boon Huat Lim is a notable inventor based in Johor, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His innovative approaches have advanced the technology used in lead frame strips and semiconductor devices.
Latest Patents
One of his latest patents is titled "Method of electrically isolating shared leads of a lead frame strip." This invention involves a lead frame strip that includes multiple connected unit lead frames, each equipped with a die paddle and several leads. A semiconductor die is attached to the die paddles, and a molding compound covers the unit lead frames. The invention features a method for etching a gap into the shared leads of adjacent unit lead frames, which allows for electrical isolation during processing.
Another significant patent is "Semiconductor device and method of packaging a semiconductor device with a clip." This patent describes a method and apparatus for packaging a semiconductor device using a clip that has defined contact regions. The clip is designed to enhance the connection between the semiconductor chip and the packaging, improving overall device performance.
Career Highlights
Boon Huat Lim has worked with prominent companies in the semiconductor industry, including Infineon Technologies and Semiconductor Components Industries, LLC. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Throughout his career, Boon Huat Lim has collaborated with talented individuals such as Chee Chian Lim and Yoke Chin Goh. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Boon Huat Lim is a distinguished inventor whose work in semiconductor packaging has led to several important patents. His contributions continue to influence the industry and pave the way for future innovations.