Infineon Technologies Ag

Semiconductor Components Industries, LLC

Boon Huat Lim

Chee Chian Lim

Saat Shukri Embong

Yoke Chin Goh

Kenneth Teik Kheong Low

Michael John Seddon

Chee Hiong Chew

James Price Letterman, Jr

Teck Sim Lee

Brian A Webb

Albert J Laninga

Frank Püschner

Franz Gabler

Aik Chong Tan

Kevin John Theseira

Bernhard Schätzler

Pei Pei Kong

Santhiragasen Al Sengram Pillay

A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Method of electrically isolating shared leads of a lead frame strip

A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Semiconductor device and method of packaging a semiconductor device with a clip

A system for manufacturing electronic device packages includes a conveyor with an adhesive work surface to support a predetermined array of external connectors for flip-chip bonding of dies thereto. After assembly, the dies with associated external connectors bonded thereto are encapsulated on a work surface of the conveyor whereby the work surface forms at least part of an inner surface of an encapsulating mold.

Method for manufacturing an electronic device package

A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Semiconductor package and method for forming same

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Johor, Malaysia

Boon Huat Lim