The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Nov. 13, 2000
Boon Huat Lim, Johor, MY;
Saat Shukri Embong, Terrengganu, MY;
Kevin J. Theseira, Singapore, SG;
Kenneth Teik Kheong Low, Singapore, SG;
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Abstract
A system for manufacturing electronic device packages includes a conveyor with an adhesive work surface to support a predetermined array of external connectors for flip-chip bonding of dies thereto. After assembly, the dies with associated external connectors bonded thereto are encapsulated on a work surface of the conveyor whereby the work surface forms at least part of an inner surface of an encapsulating mold.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile