Singapore, Singapore

Kenneth Teik Kheong Low


Average Co-Inventor Count = 5.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: Kenneth Teik Kheong Low: Innovator in Semiconductor Packaging

Introduction

Kenneth Teik Kheong Low is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to electronic device manufacturing.

Latest Patents

One of Kenneth's latest patents is titled "Method for manufacturing an electronic device package." This patent describes a system for manufacturing electronic device packages that includes a conveyor with an adhesive work surface. This work surface supports a predetermined array of external connectors for flip-chip bonding of dies. After assembly, the dies with associated external connectors are encapsulated on the conveyor's work surface, which forms part of the inner surface of an encapsulating mold.

Another significant patent is "Semiconductor package and method for forming same." This patent details a semiconductor package that includes a die with die pads coupled to inner ends of interconnects. The die and interconnects are molded in a mold compound, with the mounting surface and outer ends exposed. This innovative design enhances the functionality and efficiency of semiconductor devices.

Career Highlights

Kenneth Teik Kheong Low is currently employed at Semiconductor Components Industries, LLC, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the manufacturing processes within the industry.

Collaborations

Throughout his career, Kenneth has collaborated with talented professionals, including Boon Huat Lim and Saat Shukri Embong. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Kenneth Teik Kheong Low is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His patents reflect a commitment to innovation and excellence in electronic device manufacturing.

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