Semiconductor Components Industries, LLC

Kenneth Teik Kheong Low

Boon Huat Lim

Saat Shukri Embong

Michael John Seddon

Chee Hiong Chew

James Price Letterman, Jr

Brian A Webb

Albert J Laninga

Aik Chong Tan

Kevin John Theseira

Santhiragasen Al Sengram Pillay

A system for manufacturing electronic device packages includes a conveyor with an adhesive work surface to support a predetermined array of external connectors for flip-chip bonding of dies thereto. After assembly, the dies with associated external connectors bonded thereto are encapsulated on a work surface of the conveyor whereby the work surface forms at least part of an inner surface of an encapsulating mold.

Method for manufacturing an electronic device package

A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Semiconductor package and method for forming same

Growing community of inventors

Singapore, Singapore

Kenneth Teik Kheong Low