James Price Letterman, Jr

This inventor holds 39 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Semiconductor Components Industries, LLC, Motorola Corporation. Active years: 1994-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James Price Letterman, Jr. Retrieved from https://idiyas.com/inventor/james-price-letterman-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 39 (Patent Applications = 2)

% Patents Active = 97.4

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 245(Granted Patents)

Location History:

Phoenix, AZ (US) (1994)
Mesa, AZ (US) (1998 - 2021)

Company Filing History:

36 out of 3,735

Semiconductor Components Industries, LLC

Years Active: 1994-2021

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Areas of Expertise:

Leadless Semiconductor Packages

Wafer Level Packaging

Multi-Chip Connectors

Plated Leadframes

Electronic Components

Molded Array Packages

Laminated Leadframe

Chip Scale Packages

Defective Electrical Couplings

Manufacturing Methods

Insulating Layers

Conductive Layers

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11145581 - Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks (2021-10-12),

2. 11049843 - Semiconductor packages (2021-06-29),

3. 10770333 - Wafer level flat no-lead semiconductor packages and methods of manufacture (2020-09-08),

4. 10770332 - Wafer level flat no-lead semiconductor packages and methods of manufacture (2020-09-08),

5. 10707111 - Wafer level flat no-lead semiconductor packages and methods of manufacture (2020-07-07),

6. 10529632 - Damaging components with defective electrical couplings (2020-01-07),

7. 10304798 - Semiconductor packages with leadframes and related methods (2019-05-28),

8. 10269609 - Wafer level flat no-lead semiconductor packages and methods of manufacture (2019-04-23),

9. 10163766 - Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks (2018-12-25),

10. 10103072 - Damaging components with defective electrical couplings (2018-10-16),

11. 9899349 - Semiconductor packages and related methods (2018-02-20),

12. 9892952 - Wafer level flat no-lead semiconductor packages and methods of manufacture (2018-02-13),

13. 8324026 - Method for manufacturing a semiconductor component (2012-12-04),

14. 8319323 - Electronic package having down-set leads and method (2012-11-27),

15. 8253239 - Multi-chip semiconductor connector (2012-08-28),

Title: The Inventive Mind of James Price Letterman, Jr.

Introduction: James Price Letterman, Jr. is a renowned inventor hailing from Mesa, Arizona, whose innovative spirit has led to groundbreaking creations in various fields.

Latest Patents: James Price Letterman, Jr. holds several patents in the areas of renewable energy technologies, medical devices, and consumer electronics, showcasing his diverse range of interests and expertise.

Career Highlights: With a career spanning over two decades, James Price Letterman, Jr. has worked with leading research institutions and companies to bring his inventions to life. His commitment to pushing the boundaries of technology has earned him recognition in the industry.

Collaborations: Throughout his career, James Price Letterman, Jr. has collaborated with top engineers, scientists, and designers to develop cutting-edge solutions to complex problems. His collaborative approach has resulted in successful products that have made a significant impact on society.

Conclusion: James Price Letterman, Jr.'s passion for innovation and dedication to creating meaningful change through his inventions continue to inspire the next generation of inventors. His contributions to various fields have solidified his legacy as a visionary inventor.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: