The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Dec. 20, 2004
Applicants:

James P. Letterman, Jr., Mesa, AZ (US);

Joseph K. Fauty, Mesa, AZ (US);

Jay A. Yoder, Phoenix, AZ (US);

William F. Burghout, Mesa, AZ (US);

Inventors:

James P. Letterman, Jr., Mesa, AZ (US);

Joseph K. Fauty, Mesa, AZ (US);

Jay A. Yoder, Phoenix, AZ (US);

William F. Burghout, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a leadless package includes down-set conductive leads having base portions. The base portions include stand-offs that attach to electrodes on an electronic chip using, for example, a solder die attach material. An optional encapsulating layer covers portions of the down-set conductive leads and portions of the electronic chip while leaving pad portions of the down-set conductive leads and a surface of the electronic chip exposed. The pad portions and the surface of the electronic chip are oriented to attach to a next level of assembly.


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