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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Jay A Yoder

This inventor holds 24 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Semiconductor Components Industries, LLC. Active years: 2004-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jay A Yoder. Retrieved from https://idiyas.com/inventor/jay-a-yoder

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24

% Patents Active = 95.8


Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 70(Granted Patents)


Location History:

  • Glendale, AZ (US) (2004)
  • Phoenix, AZ (US) (2007 - 2024)

Company Filing History:

goldMedal24 out of 3,735 
 
Semiconductor Components Industries, LLC
 patents

Years Active: 2004-2024

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Areas of Expertise:
Semiconductor Package
Multi-Chip Connector
Die Singulation
Low Profile Device
Leadframe Package
Connector Assemblies
Manufacture Methods
Thermal Management
Solder Flow Control
Electronic Package
24 patents (USPTO):Explore Patents
1. 11984388 - Semiconductor package structures and methods of manufacture (2024-05-14),
2. 11710686 - Semiconductor package structures and methods of manufacture (2023-07-25),
3. 11217515 - Semiconductor package structures and methods of manufacture (2022-01-04),
4. 10522448 - Single or multi chip module package and related methods (2019-12-31),
5. 9911684 - Holes and dimples to control solder flow (2018-03-06),
6. 9870986 - Single or multi chip module package and related methods (2018-01-16),
7. 9847219 - Semiconductor die singulation method (2017-12-19),
8. 9558968 - Single or multi chip module package and related methods (2017-01-31),
9. 9484210 - Semiconductor die singulation method (2016-11-01),
10. 9034733 - Semiconductor die singulation method (2015-05-19),
11. 8664089 - Semiconductor die singulation method (2014-03-04),
12. 8574961 - Method of marking a low profile packaged semiconductor device (2013-11-05),
13. 8319323 - Electronic package having down-set leads and method (2012-11-27),
14. 8253239 - Multi-chip semiconductor connector (2012-08-28),
15. 7875964 - Multi-chip semiconductor connector and method (2011-01-25),

Title: The Innovative Journey of Jay A Yoder

Introduction: Jay A Yoder, a talented inventor based in Phoenix, AZ, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Jay A Yoder holds several patents in various technological domains, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: Throughout his career, Jay A Yoder has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His inventions have revolutionized industries and improved the lives of many.

Collaborations: Jay A Yoder has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work with diverse teams and experts has been instrumental in the success of his projects.

Conclusion: Jay A Yoder's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the technological landscape is truly remarkable.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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