The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2014

Filed:

Aug. 20, 2012
Applicants:

William F. Burghout, Mesa, AZ (US);

Dennis Lee Conner, Glendale, AZ (US);

Michael J. Seddon, Gilbert, AZ (US);

Jay A. Yoder, Phoenix, AZ (US);

Inventors:

William F. Burghout, Mesa, AZ (US);

Dennis Lee Conner, Glendale, AZ (US);

Michael J. Seddon, Gilbert, AZ (US);

Jay A. Yoder, Phoenix, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and fluid machining the semiconductor wafer to remove the backmetal layer from the singulation lines.


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