logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9847219 B1

PDFFull Text
Date of Patent:
Dec. 19, 2017

Filed:

Sep. 16, 2016

Semiconductor die singulation method

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

William F. Burghout, Mesa, AZ (US);

Dennis Lee Conner, Glendale, AZ (US);

Michael J. Seddon, Gilbert, AZ (US);

Jay A. Yoder, Phoenix, AZ (US);

Gordon M. Grivna, Mesa, AZ (US);

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Kevin B. Jackson

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02076 (2013.01); H01L 21/3043 (2013.01); H01L 21/3046 (2013.01); H01L 21/3065 (2013.01); H01L 21/67028 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 21/7813 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01);
Abstract

In one embodiment, semiconductor die are singulated from a semiconductor wafer having a layer of material by placing the semiconductor wafer onto a carrier tape with the layer of material adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the layer of material within the singulation lines, and separating portions of the layer of material using a fluid.

Find Patent Forward Citations

Burghout, William. (2017). Semiconductor die singulation method (U.S. Patent No. 9847219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9847219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…