The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Sep. 11, 2018
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Darrell D. Truhitte, Phoenix, AZ (US);
James P. Letterman, Jr., Mesa, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/268 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); H01L 21/268 (2013.01); H01L 24/35 (2013.01); H01L 24/43 (2013.01); H01L 24/40 (2013.01); H01L 2224/35848 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/43848 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01);
Abstract
A method, in some embodiments, comprises: providing a component having first and second electrical nodes; determining that the component lacks multiple, functional electrical couplings between said first and second nodes; damaging at least part of the component as a result of said determination; and determining, as a result of said damage, that the component is defective.