Phoenix, AZ, United States of America

Darrell D Truhitte

This inventor holds 24 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Semiconductor Components Industries, LLC. Active years: 2005-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Darrell D Truhitte. Retrieved from https://idiyas.com/inventor/darrell-d-truhitte

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 88(Granted Patents)


Company Filing History:


Years Active: 2005-2025

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Areas of Expertise:
Leadless Semiconductor Packages
Wafer Level Packages
Plasma Etching
Leadframes
Electrical Couplings
Carrier Tape
Semiconductor Devices
Manufacturing Methods
Wettable Flanks
Standoff Units
Singulated Packages
Marking Systems
24 patents (USPTO):Explore Patents

Title: The Innovative Journey of Darrell D. Truhitte

Introduction

Darrell D. Truhitte is a distinguished inventor based in Phoenix, AZ, with an impressive portfolio consisting of 23 patents. His groundbreaking work primarily focuses on semiconductor technologies, showcasing his commitment to advancing the field through innovation.

Latest Patents

Among Truhitte's latest advancements are methods for forming leadless semiconductor packages with plated leadframes and wettable flanks. This invention involves a systematic approach where a metal layer is plated onto a substrate to create an essential contact extending across a saw street. The encapsulant is then strategically deposited over the contact before removing the substrate to expose both the contact and encapsulant. Following this, the encapsulant and contact are singulated, ensuring precision in each package.

Additionally, he has developed methods for forming semiconductor packages which include providing a leadframe, coupling a semiconductor die or electronic component, and encapsulating parts of the device using a mold compound. Notably, Truhitte's method allows for the exposure of multiple leads of the leadframe and incorporates advanced techniques for singulating the leadframe to form several semiconductor packages.

Career Highlights

Truhitte's career includes significant contributions while working at various prominent organizations. He has been associated with Semiconductor Components Industries, LLC, where he played a crucial role in inventing and refining semiconductor technologies. His expertise and dedication to innovation have been pivotal in the advancement of semiconductor packaging processes.

Collaborations

Throughout his career, Truhitte has had the opportunity to collaborate with notable professionals in the field, including James Price Letterman, Jr. and Phillip Celaya. These partnerships have enriched his work experience and contributed to the successful development of cutting-edge semiconductor technologies.

Conclusion

Darrell D. Truhitte exemplifies the spirit of innovation in the semiconductor industry. With a robust portfolio of patents and a dedication to advancing technology, he continues to influence the field, ensuring the development of efficient and effective semiconductor solutions. His contributions are a testament to the importance of collaboration and creativity in driving technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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