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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10163766 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

Nov. 21, 2016

Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Darrell D. Truhitte, Phoenix, AZ (US);

James P. Letterman, Jr., Mesa, AZ (US);

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

IPTechLaw

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49805 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 21/568 (2013.01); H01L 24/45 (2013.01); H01L 2021/60015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract

A leadless package with wettable flanks is formed by providing a substrate and plating a metal layer onto the substrate to form a contact on the substrate extending across a saw street. An encapsulant is deposited over the contact. The substrate is removed to expose the contact and encapsulant. The encapsulant and contact are singulated. In some embodiments, the substrate includes a ridge, and the contact is formed over the ridge.

Find Patent Forward Citations

Truhitte, Darrell. (2018). Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks (U.S. Patent No. 10163766). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10163766

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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