The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2002
Filed:
Nov. 13, 2000
Applicant:
Inventors:
Saat Shukri Embong, Kuala Terengganu, MY;
Hou Boon Tan, Seremban, MY;
Kuan Ming Kan, Negera Sembilan, MY;
Assignee:
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/182 ;
U.S. Cl.
CPC ...
H01L 2/182 ;
Abstract
A method of forming a semiconductor package ( ) on a leadframe ( ) trimmed from strip ( ). Encapsulant ( ) forms plastic tie bars ( ) linking the semiconductor package ( ) and the strip ( ), to mechanically support, but electrically isolate, the semiconductor die ( ) for functionality testing.