The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2002
Filed:
Dec. 04, 2000
Applicant:
Inventors:
Saat Shukri Embong, Kuala Terengganu, MY;
Chee Chew Hiong, Negeri Sembilan, MY;
Assignee:
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ;
Abstract
A semiconductor component includes a semiconductor chip ( ), an electrically conductive adhesive located over the semiconductor chip, and a clip bond ( ) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.