This inventor holds 1 USPTO granted patent. Top assignee: Semiconductor Components Industries, LLC. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Innovations of Chee Chew Hiong
Introduction
Chee Chew Hiong is a notable inventor based in Negeri Sembilan, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the functionality of semiconductor components.
Latest Patents
Chee Chew Hiong holds a patent for a technology titled "Ball-less clip bonding." This invention involves a semiconductor component that includes a semiconductor chip, an electrically conductive adhesive located over the semiconductor chip, and a clip bond situated over the electrically conductive adhesive. The clip bond features at least one burr designed to retain the electrically conductive adhesive. This innovation represents a significant advancement in semiconductor manufacturing.
Career Highlights
Chee Chew Hiong is currently employed at Semiconductor Components Industries, LLC, where he continues to work on cutting-edge technologies in the semiconductor sector. His expertise and innovative mindset have made him a valuable asset to his company.
Collaborations
He collaborates with various professionals in the industry, including his coworker, Saat Shukri Embong. Their combined efforts contribute to the advancement of semiconductor technologies.
Conclusion
Chee Chew Hiong's contributions to semiconductor technology through his patent and work at Semiconductor Components Industries, LLC highlight his role as an influential inventor in the field. His innovative spirit continues to drive advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile