The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Dec. 04, 2000
Applicant:
Inventors:
Saat Shukri Embong, Kuala Terengganu, MY;
Dave Culbertson, Tempe, AZ (US);
Chee Hiong Chew, Negeri Sembilan, MY;
Assignee:
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method of manufacturing a semiconductor component includes coupling a clip bond ( ) from a semiconductor chip ( ) to a lead frame ( ) and dividing the clip bond into at least first and second portions separated from each other.