This inventor holds 3 USPTO granted patents. Top assignee: Disco Corporation. Active years: 2008-2021.
Company Filing History:
Years Active: 2008-2021
Title: Ryuji Norimoto: Innovator in Wafer Processing Technologies
Introduction
Ryuji Norimoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 3 patents. His innovative methods have advanced the technology used in the semiconductor industry.
Latest Patents
Norimoto's latest patents include a wafer processing method and a wafer dividing method. The wafer processing method involves dividing a wafer with a functional layer laminated to its top surface. This method includes several steps, such as disposing of a protective member, forming a cut groove, and plasma etching to divide the substrate along designated streets. The wafer dividing method entails applying a liquid resin to the back side of the wafer to form a shield film, which is then removed using a laser beam. This process allows for precise division of the wafer into multiple device chips.
Career Highlights
Ryuji Norimoto is currently employed at Disco Corporation, where he continues to develop innovative solutions in wafer processing. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Norimoto collaborates with notable coworkers, including Tadato Nagasawa and Takatoshi Masuda. Their combined expertise contributes to the advancement of technologies in their field.
Conclusion
Ryuji Norimoto's contributions to wafer processing technologies reflect his dedication to innovation and excellence. His patents and ongoing work at Disco Corporation position him as a key figure in the semiconductor industry.