The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Oct. 23, 2017
Disco Corporation, Tokyo, JP;
Ryuji Norimoto, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
Disclosed herein is a wafer dividing method including a shield film forming step of applying a liquid resin to the back side of a wafer having a plurality of devices on the front side, thereby forming a shield film from the liquid resin, the liquid resin containing a laser absorbing agent for absorbing a laser beam, a shield film removing step of applying the laser beam along each division line to the shield film formed on the back side of the wafer, thereby performing ablation to remove the shield film along each division line, and a dividing step of plasma-etching the wafer from the back side thereof after performing the shield film removing step, thereby partially removing the wafer in an area corresponding to each division line to thereby divide the wafer into a plurality of device chips.