The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Nov. 27, 2006
Ryuji Norimoto, Tokyo, JP;
Tadato Nagasawa, Tokyo, JP;
Takatoshi Masuda, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
The present invention grinds the rear surface side of a device area to form a recessed portion and an annular reinforcement part on the outer periphery of the recessed portion, removes the annular reinforcement part by grinding or cutting the rear surface of the annular reinforcement part so as to give the wafer a uniform thickness, locates the position of streets in the front surface of the wafer by infrared imaging from the rear surface side of the wafer, and after dividing the wafer into individual devices affixes dicing tape to the rear surface of the wafer divided into devices, supports the rear surface of the wafer on a dicing frame and peels a protective member off the front surface of the wafer, thereby enabling the wafer to be supported using ordinary dicing tape while posing no obstacle to device pick-up after division of the wafer.