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Ryuichiro Mori

USPTO Granted Patents = 10

Average Co-Inventor Count = 1.5

ph-index = 7

Forward Citations = 683(Granted Patents)

Location History:

Hyogo, JP (1989)
Itami, JP (1989 - 1992)
Tokyo, JP (1997 - 2002)

Company Filing History:

10 out of 21,351

Mitsubishi Denki Kabushiki Kaisha

Years Active: 1989-2002

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6369447 - Plastic-packaged semiconductor device including a plurality of chips (2002-04-09),

2. 6163070 - Semiconductor package utilizing a flexible wiring substrate (2000-12-19),

3. 5903049 - Semiconductor module comprising semiconductor packages (1999-05-11),

4. 5659199 - Resin sealed semiconductor device (1997-08-19),

5. 5139969 - Method of making resin molded semiconductor device (1992-08-18),

6. 5042123 - Computer controlled automated semiconductor production apparatus (1991-08-27),

7. 4942454 - Resin sealed semiconductor device (1990-07-17),

8. 4884124 - Resin-encapsulated semiconductor device (1989-11-28),

9. 4878610 - Die bonding apparatus (1989-11-07),

10. 4857989 - Semiconductor device (1989-08-15),

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