The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Oct. 14, 1998
Ryuichiro Mori, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
There are described an improvement in the mass-productivity of a plastic-packaged semiconductor device which includes a plurality of chips that are connected to leads and assembled into one package while their main surfaces are positioned so as to oppose one another and which enables selection of one of the chips with a fewer number of leads. The semiconductor device includes a pair of identical chips including a plurality of electrode pads provided in a row in the center of the main surface of the chip, and the electrode pads provided in the corresponding positions form a pair of electrode pads. The plurality of electrode pads which permit input or output of a common signal in or from the chips are connected to the respective sides of the common lead by way of a pair of electrode bumps. Two pairs of electrode pads which permit input or output of individual signals to the respective chips and which are provided side by side to each other are electrically connected to respective sides of the common lead by way of an electrode bump formed on one of the pair of electrode pads as well as by way of another adjacent electrode bump formed on the electrode pad of the other pair of electrode pads.