The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 1997
Filed:
Apr. 08, 1996
Applicant:
Inventors:
Ryuichiro Mori, Tokyo, JP;
Shunichi Abe, Tokyo, JP;
Tatsuhiko Akiyama, Tokyo, JP;
Michitaka Kimura, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257676 ; 257666 ;
Abstract
A resin sealed semiconductor device includes a lead frame having a die pad; a semiconductor element mounted on the die pad; a resin sealing the lead frame and the semiconductor element, the die pad including a plurality of through holes where the semiconductor element is mounted; and a resin film bonding the semiconductor element to the die pad.
Mori, Ryuichiro. (1997). Resin sealed semiconductor device (U.S. Patent No. 5659199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5659199
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile