Mitsubishi Denki Kabushiki Kaisha

Ryuichiro Mori

Tatsuhiko Akiyama

Katsuyuki Fukudome

Toshinobu Banjo

Shunichi Abe

Michitaka Kimura

Syuichi Osaka

Yoshitaka Takemoto

There are described an improvement in the mass-productivity of a plastic-packaged semiconductor device which includes a plurality of chips that are connected to leads and assembled into one package while their main surfaces are positioned so as to oppose one another and which enables selection of one of the chips with a fewer number of leads. The semiconductor device includes a pair of identical chips including a plurality of electrode pads provided in a row in the center of the main surface of the chip, and the electrode pads provided in the corresponding positions form a pair of electrode pads. The plurality of electrode pads which permit input or output of a common signal in or from the chips are connected to the respective sides of the common lead by way of a pair of electrode bumps. Two pairs of electrode pads which permit input or output of individual signals to the respective chips and which are provided side by side to each other are electrically connected to respective sides of the common lead by way of an electrode bump formed on one of the pair of electrode pads as well as by way of another adjacent electrode bump formed on the electrode pad of the other pair of electrode pads.

Plastic-packaged semiconductor device including a plurality of chips

A semiconductor package having a plurality of electrodes arranged along one side of a rectangular semiconductor element; a plurality of wirings, one end of the wiring to be electrically connected with the electrode being arranged adjacent to the electrode and the other end of the wiring being exposed from an opening for external connection; a conductive member provided on the opening for external connection; a flexible wiring substrate on which the semiconductor element is mounted, and the wiring and the conductive member are arranged; and a sealing resin for sealing, except for the conductive member, the semiconductor element and a periphery of the semiconductor element. The semiconductor package can be connected in a horizontal or inclined condition with respect to the substrate for packaging by folding the flexible wiring substrate.

Semiconductor package utilizing a flexible wiring substrate

Each of two semiconductor elements 1a or 1b is connected to wiring patterns 3a or 3b on an element substrate 2a or 2b via a bump 4a or 4b, respectively. These members are sealed off by sealing resin to form a semiconductor package 6a or 6b, and the same are disposed on a mounting substrate 8 one above the other with an adhesive agent 9 applied thereto. A portion of the wiring pattern 3a not covered by the sealing resin 5, which portion is connected to the semiconductor element 1a, a portion of the wiring pattern 3b connected to the semiconductor element 1b, and an electrode on the mounting substrate 8 are electrically interconnected by connecting wires 7.

Semiconductor module comprising semiconductor packages

A resin sealed semiconductor device includes a lead frame having a die pad; a semiconductor element mounted on the die pad; a resin sealing the lead frame and the semiconductor element, the die pad including a plurality of through holes where the semiconductor element is mounted; and a resin film bonding the semiconductor element to the die pad.

Resin sealed semiconductor device

A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encapsulating the semiconductor element in a sealing resin in a mold and then dissolving the coating resin. Then, a metal is disposed in the holes formed in the sealing resin to provide external electrodes. Since the external electrodes are provided on the electrodes of the semiconductor element, the packaging area has the same dimensions as the resin package, and the packaging area of the semiconductor device can be reduced.

Method of making resin molded semiconductor device

An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for assembling a die and a lead frame into a semiconductor device; an automatic die/lead frame transport device for transporting the dice split by the splitting device and lead frames stored in the automatic warehouse to the assembly device; and a computer for controlling the automatic die/lead frame transport device to transport the lead frames of the type and quantity corresponding to the dice split by the splitting device, from the automatic warehouse to the assembly devices. The computer compares the number of non-defective dice with a predetermined production quantity and ensures that a sufficient quantity of non-defective dice to satisfy the production quantity are split and transported to the assembly device. This apparatus is suitable for producing a large variety of semiconductor devices in small lots on an automated continuous basis.

Computer controlled automated semiconductor production apparatus

A resin-sealed semiconductor device comprises a die pad which has through holes. Thin metal films are provided on the surfaces of the die pad except for the wall surfaces of the holes. A resin, which is used for integral molding of the die pad and a semiconductor element, flows into the holes during molding. The semiconductor device so mounted does not induce cracks in the resin and, thus, has good moisture resistance.

A semiconductor device comprises a semiconductor element which is bonded to a flat base and encapsulated in a resin. The base has a bonding section at its center to which the semiconductor element is bonded, the area of the bonding section being smaller than that of the bottom surface of the semiconductor element. The portion of the base outside the bonding section has a plurality of through holes or depressions formed in its top and bottom surfaces which increase the adhesion between the resin and the base. The bonding section may be substantially separated from the remainder of the base by elongated through holes or depressions which substantially surround the bonding section.

Resin-encapsulated semiconductor device

A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.

Die bonding apparatus

A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4.times.4 mm.sup.2. The concave portion is filled with a bonding material, and the semiconductor element and the semiconductor element mounting member are bonded by the bonding material.

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Tokyo, Japan

Ryuichiro Mori