The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 1989
Filed:
Sep. 04, 1987
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 80 ; 357 72 ; 357 68 ;
Abstract
A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4.times.4 mm.sup.2. The concave portion is filled with a bonding material, and the semiconductor element and the semiconductor element mounting member are bonded by the bonding material.