Katsuyuki Fukudome

Title: Katsuyuki Fukudome: Semiconductor Packaging Inventions

Introduction

Katsuyuki Fukudome is an inventor associated with Itami, Japan, and Mitsubishi Electric Corporation. His work includes inventions focused on resin-encapsulated semiconductor devices and improving the reliability of their packaging. He is credited with 3 patents.

Latest Patents

Fukudome’s listed patents address how semiconductor components are secured and protected within resin packaging.

“Resin sealed semiconductor device” describes a die pad with through holes. Thin metal films cover the die pad’s surfaces but not the holes’ inner walls. During molding, resin flows into the holes, helping secure the die pad and semiconductor element while reducing the risk of resin cracks and supporting moisture resistance.

“Resin-encapsulated semiconductor device” describes a semiconductor element bonded to a flat base and enclosed in resin. The element is attached to a central bonding section smaller than its bottom surface. Through holes or depressions in the surrounding base improve adhesion between the base and resin. The design may also use elongated holes or depressions to substantially separate and surround the bonding section.

Career Highlights

Fukudome’s patent work reflects attention to the practical challenges of semiconductor packaging, including adhesion, moisture resistance, and cracking. The described designs use features in the die pad or base to strengthen the relationship between the resin and the device’s supporting structure.

Collaborations

Fukudome’s listed coworkers include Ryuichiro Mori and Tatsuhiko Akiyama. His company affiliation is Mitsubishi Electric Corporation.

Conclusion

Katsuyuki Fukudome’s documented inventions focus on structural improvements to resin-sealed semiconductor devices, with designs intended to enhance packaging adhesion and reliability.