Location History:
- Hanno, JP (2013 - 2017)
- Saitama, JP (2018)
Company Filing History:
5 out of 356 
2 out of 8 Years Active: 2013-2018
Title: Ryo Matsubayashi: Innovator in Bonding Technologies
Introduction
Ryo Matsubayashi is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of bonding technologies, holding a total of 5 patents. His innovative methods have advanced the way electronic components are bonded to substrates, enhancing the efficiency and reliability of electronic devices.
Latest Patents
Matsubayashi's latest patents include a method of manufacturing a bonded body. This method involves bonding a substrate and an electronic part using a metal particle paste. The process includes several steps: assembling the electronic part onto the substrate with the paste, arranging the assembled body between two heating plates, and applying heat and pressure to bond the components. The bonding occurs at temperatures ranging from 0°C to 150°C, ensuring minimal sintering reaction of the metal particle paste.
Another significant patent is for a bonding device designed to bond substrates and electronic parts. This device utilizes a pressure applying unit that transfers both pressure and heat to the assembled body. It features a heating mechanism with two opposing heating parts, a positioning mechanism, and a pressure applying mechanism, all working together to achieve effective bonding.
Career Highlights
Throughout his career, Ryo Matsubayashi has worked with prominent companies, including Shindengen Electric Manufacturing Company Limited and Applied Nanoparticle Laboratory Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in bonding technologies.
Collaborations
Matsubayashi has collaborated with notable colleagues such as Teruo Komatsu and Yuji Morinaga. Their combined expertise has fostered innovation and development in their respective fields.
Conclusion
Ryo Matsubayashi is a distinguished inventor whose work in bonding technologies has made a significant impact on the electronics industry. His innovative patents and collaborations highlight his commitment to advancing technology and improving manufacturing processes.