The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Jul. 16, 2009
Teruo Komatsu, Osaka, JP;
Ryo Matsubayashi, Hanno, JP;
Teruo Komatsu, Osaka, JP;
Ryo Matsubayashi, Hanno, JP;
Applied Nanoparticle Laboratory Corporation, Osaka, JP;
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Abstract
Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to conventional lead-rich solders. The composite nanometal paste contains, as metal components, composite metal nanoparticles comprising metal cores with an average particle diameter of d (nm) and an organic coating layer formed around the circumference, and metal filler particles having an average particle diameter of D (nm), and satisfies the first relation d<D and the second relation d<100 (nm). When said organic coating layer volatilizes so that a metal layer is formed by sintering, the size relation between said average particle diameters d, D is designed so that said composite metal nanoparticle can be embedded in a hollow four pocket formed when it is assumed that four said metal filler particles are placed so that they come in contact with a tetrahedron, and it has a property in which said composite metal nanoparticles and said metal filler particles sinter compactly.